Flip chip interconnect PDF Print E-mail
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Written by Advanced Packaging   

Flip Chip Interconnect

Flip Chip Interconnect.

controlled collapse chip connection bump technology, developed in the late 1960s, provided a reliable interconnect for high-performance, leading-edge microprocessors.

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Volume Assembly Qualification for 0201 Packages PDF Print E-mail
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Written by SMTA International   

Ant with 0201 chip component

Volume Assembly Qualification for 0201 Packages.

A Qualificatio vehicle is designed that includes studies of such process parameters as solder-paste printing, component Pick-and-Place and Solder Reflow.
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