There are many things that can go wrong when soldering to gold plate over nickel surfaces..

First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong.

In this article you will find some basics to start / check the Parameters for a wave soldering machine.

You will also find and a explanation of the technical vocabulary such as "Dwell time, Solidification time and wetting time.

The Benefits of a Ramp-to-Spike Reflow Profile.

The pains often associated with profiling may be reduced greatly if certain guidelines are followed and if there is a sftrong understanding of the variables that can be encountered during the reflow process

Obviously, the soldering profile created in the reflow oven is one of the most important factors in determining defect rates in the SMT manufacturing process.
To gain or to maintain a good process realising the necessarily high yield, board assemblers have to look carefully and eventually optimise plenty of adjustments.

Investigation of small solder balls produced during wave soldering suggest a tightening of process controls and the correct solder mask.