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Causes and Cures of Flipped Component
Process Defect Guide


Flipped Component

The component is placed up side down. Mainly seen on resistors. A flipped ceramic capacitor will not be recognizable and will not cause any problems.

Cause:
The resistor is flipped around in the tape during tape indexing, picked up and placed. A resistor placed up side down, means less insulation distance to tracks under component (only glass coating and solder resist).

Solution:
Check the feeder for faults. E.g. too fast indexing speed or missing tape cover etc.

Repair:
The flipped component is removed using a professional soldering iron. Add a little flux to the solder joints, heat the solder joints at each end of the component and remove it. To remove the remaining solder, add a little flux to the solder joint, place a de-soldering braid on the solder pads, place the soldering iron tip on top and heat-up the solder alloy until the solder is melted into the braid and lift. Repeat until all solder is removed. Place a new component on the solder pad. Hold it steady while soldering the first terminal using solder wire. Now, solder the remaining terminals. Clean if necessary using isopropanol, a cotton bud or brush and lint free cloth until all flux is removed.

 
References


Circuits Assembly. (Process Defect Clinic)


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