What Causes encapsulated out-gassing (Voiding)? Voiding is a phenomenon primarily caused by encapsulated out-gassing of solvents.
The voids are often located at non-wetted spots between the solder joint and the pad or component lead. But also flux can be encapsulated in the middle of the solder joint.
What Causes Solder Beading? Often confused with solder
balling, solder beading is a defect recognized by
one or a few larger balls, generally located around
chip caps and resistors.
Causes and Cures of Tombstoning
Chip Components A tombstone - sometimes called a Manhattan skyline, crocodile,
leaning tower or space rocket - is a chip component that has
partially or completely lifted off one end of the surface of
the pad.
Causes and Cures of Flipped Component The resistor is flipped around in the tape during tape indexing, picked up and placed.
A resistor placed up side down, means less insulation distance to tracks under component (only glass coating and solder resist)......
Causes and Cures of Solder flags or
spikes Solder fags - also called solder spikes - looks like
a flag of tin left on a lead. Solder flags or spikes are due either to inconsistent
flux application or poor control of solder drainage from the
wave.
The information contained
in these Technical Bulletins is based on data considered accurate.
No warranty is expressed or implied regarding the accuracy
of this data. Liability is expressly disclaimed for any any
loss or injury arising out of this information or use of any
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