Soldering to Gold over Nickel surfaces.
There are many things that can go wrong when soldering to gold plate over nickel surfaces.
First of all, we know that gold and solder are not good friends,....

Process Parameters Wave soldering.
In this article you will find some basics to start / check the Parameters for a wave soldering machine. You will also find and a explanation of the technical vocabulary such as "Dwell time, Solidification time and wetting time.

The Benefits of a Ramp-to-Spike Reflow Profile.
The issue of reflow profiling has been and continues to be a hot topic.
Questions ranging from Why Profile? to How To Profile? to How Can I Better Profile? continue to proliferate.
This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the advantages of newer-style reflow ovens and the benefits of implementing the linear ramp-to-spike profile.

Minimizing defects on board assemblies by reflow profile adjustments.
Obviously, the soldering profile created in the reflow oven is one of the most important factors in determining defect rates in the SMT manufacturing process. To gain or to maintain a good process realising the necessarily high yield, board assemblers have to look carefully and eventually optimise plenty of adjustments.

Reducing solder microballs in innert wave soldering.
Investigation of small solder balls produced during wave soldering suggest a tightening of process controls and the correct solder mask.

Nitrogen in refow
Nitrogen is used in reflow soldering to drive out the oxygen from the soldering chamber. This prevents the solder pads and component terminals to oxidise during reflow of the solder paste.