Volume
Assembly Qualification for 0201 Packages In this work, a QV is designed for 0201 packages including
more than 5,000 locations for 0201s and 1,400 locations for 0402
components, with the pad-to-pad spacing for 0201 components ranging
from 0.010, 0.008 to 0.006".
No-clean solder pastes and 0201 components from several different
vendors are evaluated.
Detailed studies are carried out on important process parameters,
including solder paste printing, component pick-and-place and
reflow.
Based on this study, 0201 capacitors show a higher defect level
than that of 0201 resistors, and solder pastes with higher tackiness
exhibit a lower defect level for 0201 assembly.
Flip
chip interconnect Until recently, controlled collapse chip connection
bump technology, developed in the late 1960s, provided a reliable
interconnect for high-performance, leading-edge microprocessors.
As device and wafer fabrication methods have progressed, however,
evaporative bump technology has been increasingly unable to meet
product demands.
Electroplated bump technology, while not new, has emerged as one
of the most desirable options currently available to meet increased
interconnect requirements.
The information contained
in these Technical Bulletins is based on data considered accurate.
No warranty is expressed or implied regarding the accuracy of
this data. Liability is expressly disclaimed for any any loss
or injury arising out of this information or use of any materials
designated.
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