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Considerations with Stencil Design |
| Considerations with Stencil Design. When designing a stencil, considerations must be made about: Aperture Size vs Pad Size, Aperture Shape, Stencil Thickness, Adhesives Printing, Stencil Manufacturing Method, Stencil Thickness, Aperture Design, etc. |
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| Stencil acquisition is not only the first Step in the assembly process, it is one of the most important. The primary function of the stencil is to facilitate solder paste deposition. The object is to transfer a precise amount of material to its exact location on the bare printed circuit board (PCB).
"It takes a good stencil to get a good print, then automation helps make it repeatable." |
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Printing of SMT Adhesives |
| The major driving force for Printing of SMT Adhesives is the higher throughput of this application method. More over, a new printing technique with thick stencils allows depositing of glue dots with different diameters and different heights.
(SMT adhesives are applied on PCB’s by dispensing, printing and pin-transfer techniques.) |
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Printing of SMT Solderpaste |
| When printing solder paste onto a PCB there is a lot of factors to consider. This is a Technical paper about printing solderpaste, with some info about stencils and a small list of failures related to printing.
Solder pastes are specially blended pastes that consist of a flux medium containing graded solder powder particles.
(The process of depositing solder paste on the board is known as Solder Paste Printing.) |
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Printing Design Principles |
| These rules are based on wide experience in combination with the learnings from the Cookson Print Optimization Project. These design rules can be considered as a starting point for your own Custom Design Rules.
(The Cookson Standards for Stencil Design, also include a version optimized for Lead-Free Processes.) |
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