The content of the site is especially meant for Company's, managers and engineers involved with Process, Quality, Semiconductors, Integrated circuits, Assemble, Placement, Wire bonding, Encapsulation, Package and inspection, etc. etc. in the electronics. Quote: "Nothing is a waste of time if you use the experience wisely. (Auguste Rodin)" Donations recieved from: KUMAR THANGAVEL(March 27, 2008) €1,00 Euro MICHELE MORO (March 21, 2008) €5,00 Euro EVANGELOS KAPSALIS (july 25, 2007) €30,00 Euro!

Dear User, TKB-4u.com is and will remain entirely free, and there is no obligation for anybody to pay for it. Nonetheless, donations are welcome for building up and maintaining the Site and possibilities to continue our work. If you are willing to give us financial support, it is more then welcome and will be used to finance resources like network and host hardware as well as internet provider bills..

SMD codes(last update March 2006)
This HTML book is designed to provide an easy means of device identification. It lists3.938device codes in alphabetical order, together with type numbers, device characteristics or equivalents and pinout information.

Causes and Cures of Flipped Component(last update April 2005)
The resistor is flipped around in the tape during tape indexing, picked up and placed.
A resistor placed up side down, means less insulation distance to tracks under component (only glass coating and solder resist).....

What Causes encapsulated out-gassing (Voiding)?(last update April 2005)
Voiding is a phenomenon primarily caused by encapsulated out-gassing of solvents.
The voids are often located at non-wetted spots between the solder joint and the pad or component lead. But also flux can be encapsulated in the middle of the solder joint......

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